Progress made in the fabrication of high-speed devices and the increasing demand for a higher level of integration in digital circuits have led to several important changes in the design of networks and computers, and in their interconnections, both on-chip and off. At present, with the faster rise times, shorter delays and higher frequencies involved simple analysis and straightforward simulation of the networks are involved and no longer possible using the old tools. It is essential to develop more complex and more sophisticated models and analysis tools for simulating the interconnecting circuits between components of the network. Computer-aided design (CAD) tools play an essential role in helping this analysis, in both the design and the simulation of the interconnects. Measurement techniques play an active role in determining the accuracy of the design methods as well as the feasibility of the design considered. Laboratory simulations allow a comparison with computer simulations and verification of the accuracy of the simulation techniques. Finally, new interconnect schemes must be devised and analyzed to replace older methodologies. The object of the proposed research is to provide a better understanding of the behavior and performance of interconnections in microelectronics packaging and high-speed digital network applications. Three important aspects can be distinguished in the study: 1) development of accurate models and analysis of signal propagation in interconnects; 2) experimental characterization of interconnections; and 3) implementation of an interconnect-based computer-aided design simulation program.
