This award provides partial funding for a Workshop that investigates the technology and applications of the electronic packaging technique called MultiChip Modules (MCMs) that are particularly relevant and of interest to the university community. MCMs represent the next generation in packaging. Currently packaging is a (if not the) major factor limiting system performance, cost reduction, and new applications. However, the technology is capital-intensive, and heretofore has been beyond the reach of most universities. Progress has now opened an opportunity window for university involvement, and this workshop is intended to investigate how to exploit this opportunity.
